DLP9000X chipset Made to support 3-D printing, Texas Instruments' new chipset for modulating the amplitude, direction and phase of incoming light is also suited for industrial applications and machine vision. A digital controller arranges the movement of micromirrors that target the light used to harden photosensitive resins.
What's new? Upgrades to the existing DLP9000 chipset. The chipset now is five times faster than its predecessor.
Benefits Flexibility, and high-precision printing. The chipset is capable of resolutions of 2,560 by 1,600 pixels at data rates of 60 gigabits per second. With more than 4 million micromirrors, the chipset can support print feature sizes of less than 1 micron. It offers exceptional pixel loading speed for real-time, continuous, high-bit-depth patterns, resulting in detailed images with high-resolution features. The chipset, which is compatible with widely available photosensitive resins and materials, supports a variety of light sources, including lasers, light-emitting diodes and lamps.
Texas Instruments Inc., Dallas, 972-995-2011, www.ti.com/dlp
